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2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
MODE REGISTER READ
Figure 64: Temperature Sensor Timing
Device
Temp
Margin
Temp
< (tTSI + ReadInterval + SysRespDelay)
2C
Temp
Grad
ient
MR4
Trip Level
tTSI
MR4 = 0x03
MR4 = 0x86
MR4 = 0x86
MR4 = 0x86
MR4 = 0x86
Time
Temperture sensor update
ReadInterval
SysRespDelay
Host MR4 READ
MRR MR4 = 0x03
MRR MR4 = 0x86
DQ Calibration
Mobile LPDDR2 devices feature a DQ calibration function that outputs one of two pre-
defined system timing calibration patterns. For x16 devices, pattern A (MRR to MRR32),
and pattern B (MRR to MRR40), will return the specified pattern on DQ0 and DQ8; x32
devices return the specified pattern on DQ0, DQ8, DQ16, and DQ24.
For x16 devices, DQ[7:1] and DQ[15:9] drive the same information as DQ0 during the
MRR burst. For x32 devices, DQ[7:1], DQ[15:9], DQ[23:17], and DQ[31:25] drive the
same information as DQ0 during the MRR burst. MRR DQ calibration commands can
occur only in the idle state.
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
89
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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